NUMERICAL SIMULATION OF A MICROCHIP COOLING WITH MICROJET ARRAY
Keywords:
Microjet impingement, thermal management, heat transferAbstract
The increasing demand for a more powerful microchip has projected power dissipation for high performance processor up to 300 Watts in 2018. With the dimensions expected to remain at 310 mm 2 , the heat density approaches the limit of conventional cooling methods. Microjet impingement cooling is a potential solution for the thermal management of these high performance microchips. This study looks into the numerical simulation of microjet arrays impinging with nozzle diameter ranging from 40 m to 76 m. Simulation results show the ability of a single-jet with 76 m diameter nozzle in cooling the microchip dissipating 4.3 Watts of heat flux over a 1 cm² area. For multiple jets array, simulation results show that it is capable of achieving very low average surface temperature. It has also identified the problem associated with the increased number of jets due to the cross flow between the jets. It is found that multiple jets have better performance than the single jet even though the flowrate per jet is much lower.References
Copeland, D., 2005. 64-bit Server Cooling Requirements, Proceedings of 21st IEEE SEMI-THERM Symposium. IEEE.
Krotzsch, S.G., 1968. Wrme and Stoffbertragung bei Pallstrmung aus Dsenund Blendenteldem, New York: McGraw-Hill/Hemisphere Publishing.
Martin, H., 1977. Heat and Mass Transfer Between Impinging Gas Jets and Solid Surfaces, Advances in Heat Transfer, 13, 1-60.
Womac, D.J. ed, 1993. Correlating Equations for Impingment Cooling of SmallHeat Sources with Single Circular Liquid Jets, ASME Journal of Heat Transfer, 115, 106-115.
Angioletti, M., Nino, E. and Ruocco, G., 2005. CFD Turbulent Modeling of Jet Impingement and its Validation by Particle Image Velocimetry and Mass Transfer Measuremnets, International Journal of Thermal Sciences, 44, 349-356.
Stefanescu, S., Mehregany, M., Leland, J. and Yerkes, K., 1999. Micro Jet Array Heat Sink for Power Electronics, Proceedings of the Twelfth IEEE International Conference on Micro Electro Mechanical Systems, MEMS, 165-170.
Wang, E.N., Zhang, L., Koo, J-M, Maveety, J.G., Sanchez, E.A., Goodson, K.E. and Kenny, T.W., 2004. Micromachined Jets for Liquid Impingement Cooling for VLSI Chips, J. Microelectromech. Sys., 13 (5), 833-842.
Fabbri, M., Jiang, S. and Dhir, V., 2003. Experimental Investigation of SinglePhase Micro Jets Impingement Cooling for Electronic Applications, Proc. ASME Heat Transfer Conf., Las Vegas, 1-8.
Fabbri, M., Jiang, S. and Dhir, V., 2005. A Comparative Study of Cooling of High Power Electronics Using Sprays and Microjets, Trans. ASME, 127, 38-48.
FLUENT. INC. 2005. FLUENT 6.1 User’s Guide, Lebanon.
Yeo, E.S., 2007. Numerical Simulation of a Microchip Cooling System, PSM Thesis, Universiti Teknologi Malaysia, Skudai.
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